With the continuous advancement of science and technology, micro-nano manufacturing technology plays an increasingly important role in various fields. Among them, Microjet laser technology has become a new precision manufacturing technology that has attracted much attention due to its high precision, high efficiency, and non-contact characteristics.
This article will deeply explore the principles, characteristics, and application prospects of Microjet laser technology in different fields.
What Is Micro Jet Laser Technology:
The focused laser beam is coupled into a high-speed water jet, and after total reflection on the inner wall of the water column, an energy beam with uniform cross-sectional energy distribution is formed. It has the characteristics of low line width, high energy density, controllable direction, and real-time reduction of the surface temperature of the processed material, providing excellent conditions for integrated and efficient finishing of hard materials.
Microjet Laser Technology Product Features:
- The laser beam is a cylindrical (parallel) laser beam;
- The laser pulse is transmitted in the water jet like an optical fiber, and is protected from any environmental factors throughout the process;
- The laser beam is focused inside the LMJ device, and is not related to the height change of the processed surface during the entire processing process, so there is no need to focus continuously during the processing process as the processing depth changes;
- In addition to ablating the processed material at the processing moment of each laser pulse, the processed material is in real-time cooling of water for about 99% of the time from the start of each pulse to the next pulse, which almost eliminates the heat-affected zone and the remelting layer, but maintains high processing efficiency;
- Continuously clean the processing surface.
Advantages of Microjet Laser Processing:
- The laser beam is a cylindrical (parallel) laser beam;
- The laser pulse is transmitted in the water jet like an optical fiber, and is protected from any environmental factors throughout the process;
- The laser beam is focused inside the LMJ device, and is not related to the height change of the processed surface during the entire processing process, so there is no need to focus continuously during the processing process as the processing depth changes;
- In addition to ablating the processed material at the processing moment of each laser pulse, the processed material is in real-time cooling of water for about 99% of the time from the start of each pulse to the next pulse, which almost eliminates the heat-affected zone and the remelting layer, but maintains high processing efficiency;
- Continuously clean the processing surface.
Application Areas of Microjet Laser Technology:
- SIC ingot rolling: wafer dicing
- SIC crystal anisotropic cutting: aerospace composite material anisotropic processing
- SIC wafer micro-hole groove: ceramic cutting
- Metallized diamond cutting: gallium nitride crystal cutting
- Gallium oxide substrate anisotropic processing ：Metal tungsten rod drilling
Development Trend of Microjet Laser Technology
Multi-material composite processing: Realize composite processing of different materials and manufacture devices with higher functional integration.
Micro-nanoscale processing: Further improve the processing accuracy to the nanometer level to meet the manufacturing needs of smaller-scale devices.
Intelligent control: Through the introduction of artificial intelligence technology, intelligent control of the processing process is realized.
Conclusion
As an emerging precision manufacturing technology, microjet laser technology has broad application prospects. With the continuous maturity and improvement of technology, microjet laser technology will play an increasingly important role in promoting the development of various fields.
